Question

An Al-5% Cu ingot is unidirectionally solidified under conditions of negligible diffusion in the solid, complete diffusion in the liquid, and local equilibrium at the interface so that the Scheil equation applies. Using the attached Al-Cu phase diagram, d. Derive the Scheil equation. e. If k=0.171, calculate the composition of the liquid when the ingot is 50 percent solid. f. What is the interface temperature at this point? g. How much eutectic and $\theta$ will form when the ingot is completely solidified. h. Plot composition versus fraction solidified in the final ingot

          An Al-5% Cu ingot is unidirectionally solidified under conditions of negligible diffusion in the solid, complete diffusion in the liquid, and local equilibrium at the interface so that the Scheil equation applies. Using the attached Al-Cu phase diagram,
d. Derive the Scheil equation.
e. If k=0.171, calculate the composition of the liquid when the ingot is 50 percent solid.
f. What is the interface temperature at this point?
g. How much eutectic and $\theta$ will form when the ingot is completely solidified.
h. Plot composition versus fraction solidified in the final ingot

$An Al-5% Cu ingot is unidirectionally solidified under conditions of negligible diffusion in the solid, complete diffusion in the liquid, and local equilibrium at the interface so that the Scheil equation applies. Using the attached Al-Cu phase diagram, d. Derive the Scheil equation. e. If k=0.171, calculate the composition of the liquid when the ingot is 50 percent solid. f. What is the interface temperature at this point? g. How much eutectic and θ will form when the ingot is completely solidified. h. Plot composition versus fraction solidified in the final ingot$

Added by Kyle G.

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