An aluminum plate of 25 mm thickness (k = 235 W/m·K) is attached to a copper plate with a thickness of 10 mm. The copper plate is heated electrically to dissipate a uniform heat flux of 5300 W/m^2. The upper surface of the aluminum plate is exposed to convection heat transfer in a condition where the convection heat transfer coefficient is 67 W/m^2·K and the surrounding room temperature is 20°C. The other surfaces of the two attached plates are insulated, allowing heat to only dissipate through the upper surface of the aluminum plate. If the surface of the copper plate that is attached to the aluminum plate has a temperature of 100°C, determine the thermal contact conductance of the aluminum-copper interface.