In this homework, assume at 300 K, n = 10^19 cm^-3, εo = 8.85 x 10^-14 F/cm, εsi = 11.7, kT = 0.0259 eV, εxs = 4.15 eV, and Eg = 1.12 eV for silicon and εsiO2 = 3.8 for SiO2.
Consider a MOS capacitor with Al gate (εoM = 4.15 eV) and HfO2 dielectric of thickness tox = 10 nm, electron affinity χox = 2.8 eV, band gap Eg = 5.7 eV, and dielectric constant εHfO2 = 19. The p-type substrate doping is NA = 2 x 10^17 cm^-3. The total oxide charge density is 5 x 10^10 cm^-2.
(a) What SiO2 thickness would yield the same oxide capacitance of 10 nm of HfO2? This is the industry term known as equivalent oxide thickness or EOT.
(b) Why is the semiconductor industry shifting from SiO2 to HfO2 for dielectric?
(c) Find the flat band and threshold voltages VFB and V.
(d) Sketch the low-frequency C-V curve for this device. Calculate and label the maximum and minimum capacitance per unit area (Cmax, Cmin) that can be reached.