Square integrated chips (ICs), 1 cm by 1 cm, mounted on a flat motherboard cannot have surface temperature exceeding 70°C. You may assume uniform surface temperature. If 33°C air blows over the motherboard at 10 m/s to cool the ICs, what is the maximum heat generation of the second IC, with a center-point 8 cm from the leading edge? [10]
If for the same air speed, we use a device at the leading edge to guarantee a totally turbulent boundary layer, what is the second IC's maximum heat generation? [10]
Table A: Thermophysical Properties of Gases at Atmospheric Pressure
Temperature (K) (°C) (Kg/m³) (kJ/kg-K) (m²/s) (W/m-K)
100 -173.15 1.032 150 3364 1.012
200 -73.15 1.3947 250 1.1614 300 1.007
400 126.85 0.786 500 0.6964
600 326.85 1.019 700 1.014 800 1.011
900 626.85 0.9950 1000 0.8714