Chapter Questions
Describe the anatomy of a copper clad laminate.
Describe howwoven glass cloth is made.
How does the resin bond to the inorganic glass substrate?
What are fillers and how do they improve the laminate property such as thermal dissipation?
What is the limitation of FR-4 grade laminate?
What electrical, thermal and mechanical properties are important in a material suited for electrical design?
Enunciate additive process technology and subtractive process technology for PCBs.
What are the functions of a solder mask?
Why is copper protected with tin or tin/lead? What are the altematives?
If line widths are 6 microns and the spaces are 12 microns, how many lines per channel would that PWB be? Assume the channel to be $2.54 \mathrm{~mm}$.
Write a process flow chart for the manufacture of a single-sided PCB.
If the chip $I / O$ pitch is 100 microns, what is the wiring density required to support that chip for direct chip attachment to the PWB?
If the build-up PWB has 10 micron lines and spaces, and has four such layers, what is its wiring density in $\mathrm{cm} / \mathrm{cm}^2$ ?
What does FR-4 laminate denote? Name the filler and the resin in FR-4.
Draw a flowchart for the manufacture of a multilayer rigid PWB.
Differentiate between electroless and electroplating, in a simple manner.
What are the factors that need control during etching process to obtain a high-quality etched board?
As a designer, what are the important characteristics you will look for in the selection of a laminate?