Q6 (45 points) Assume a 35 cm diameter wafer has a cost of 15, contains 100 dies, and has 0.048 defects/cm2. Assume a 40 cm diameter wafer has a cost of 20, contains 120 dies, and has 0.068 defects/cm2. a. (10 points) Find the yield for both wafers. b. (10 points) Find the cost per die for both wafers. c. (10 points) If the number of dies per wafer is increased by 20% and the defects per area unit increases by 30%, find the die area and yield. d. (10 points) Assume a fabrication process improves the defects per unit area from 0.068 defects/cm2 to 0.052 defects/cm2. Find the yield for each version of the technology given a die area of 400 mm2. e. (5 points) Assume that the 40 cm wafer is manufactured using a new process that improves the yield by 15%. What is the new yield, and how does it affect the cost per die? Compare the cost per die before and after the yield improvement.