4) Estimate $R_{j-s}$ of the below assembly:
$T_j$
$q$
$R_{Si,bulk}$
$R_{DA,spreading+bulk}$
$R_{subst,spreding+bulk}$
$T_s$
$T_s = const.$
Dimension and thermal properties of the constituents are as follows:
\begin{tabular}{|l|l|l|l|}
\hline
Material & Dimension [mm] & Conductivity [W/m-K] \\
\hline
Die & Si & 6.3\times6.3\times0.35 & 180 \\
Die attach & Die attach material & 8.4\times8.4\times0.04 & 2.5 \\
Substrate & Substrate material & 21\times21\times0.4 & 0.303 \\
\hline
\end{tabular}
Solution:
$R_{j-s} = R_{Si,bulk} + R_{DA,spreading+bulk} + R_{subst,spreading+bulk}$
$= 0.0490 + 9.35 + 16.9 = 26.3 [^\circ C/W] \leftarrow$