Approximately $10^{6}$ discrete electrical components can be placed on a single integrated circuit (chip), with electrical heat dissipation as high as $30,000 \mathrm{~W} / \mathrm{m}^{2}$. The chip, which is very thin, is exposed to a dielectric liquid at its outer surface, with $h_{o}=1000 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}$ and $T_{\infty, 0}=20^{\circ} \mathrm{C}$, and is joined to a circuit board at its inner surface. The thermal contact resistance between the chip and the board is $10^{-4} \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}$, and the board thickness and thermal conductivity are $L_{b}=5 \mathrm{~mm}$ and $k_{b}=1 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}$, respectively. The other surface of the board is exposed to ambient air for which $h_{i}=40$ $\mathrm{W} / \mathrm{m}^{2} \cdot \mathrm{K}$ and $T_{\infty, i}=20^{\circ} \mathrm{C}$.
(a) Sketch the equivalent thermal circuit corresponding to steady-state conditions. In variable form, label appropriate resistances, temperatures, and heat fluxes.
(b) Under steady-state conditions for which the chip heat dissipation is $q_{c}^{\prime \prime}=30,000 \mathrm{~W} / \mathrm{m}^{2}$, what is the chip temperature?
(c) The maximum allowable heat flux, $q_{c, m}^{\prime \prime}$, is determined by the constraint that the chip temperature must not exceed $85^{\circ} \mathrm{C}$. Determine $q_{c, m}^{\prime \prime}$ for the foregoing conditions. If air is used in lieu of the dielectric liquid, the convection coefficient is reduced by approximately an order of magnitude. What is the value of $q_{c, m}^{\prime \prime}$ for $h_{o}=100 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}$ ? With air cooling, can significant improvements be realized by using an aluminum oxide circuit board and/or by using a conductive paste at the chip/board interface for which $R_{t, c}^{n}=10^{-5} \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}$ ?